Hololens 2 could give the Always Connected PC a new, ‘aggressive’ form

Microsoft’s next-generation Hololens will be an augmented reality Always Connected PC. Qualcomm reassured us that more “aggressive form factors” will be coming to the Snapdragon PC platform, and the latest rumor suggests that Microsoft could release its Hololens with the same Snapdragon 850 chipset that’s found on today’s convertible Always Connected PCs, like the HP Envy x2 and the Samsung Galaxy Book 2. The Qualcomm-powered headset could debut for enterprise customers by the second quarter of 2019.An earlier rumor suggested that Microsoft may rely on Qualcomm’s Snapdragon XR1 platform, a chipset that is designed specifically for augmented and virtual reality applications, on its next HoloLens, but we’re now learning that Microsoft may favor the always-on LTE connectivity found on the Snapdragon 850. Though Microsoft didn’t opt for Qualcomm’s flagship processor, the recently announced Snapdragon 8cx chipset, Microsoft reaffirmed that the next Hololens will utilize an A.I. coprocessor. Coprocessors dedicated to machine learning and artificial intelligence have been used in the past on rival chips, such as the Apple A series processors on recent iPhones and Huawei’s Kirin processors.